PhD-New Metallurgies for Low-Temperature Hybrid Bonding in Fan-Out Wafer Level Packaging

id="offer-description" class="ecl-u-type-heading-2 ecl-u-mt-none ecl-u-mb-l">Offer Description Context:. Advanced packaging technologies are at the core of the microelectronics revolution and play a key role in areas such as artificial intelligence, aerospace, and high performance computing. Among these technologies, Fan Out Wafer Level Packaging (FOWLP) stands out for its high interconnection density and efficient use of space, enabling more compact and powerful systems. Hybrid bonding, combining polymer dielectrics with metallic interconnections, is a crucial enabling step. However, copper based approaches face challenges related to oxidation and high processing temperatures. This PhD project proposes to explore alternative metallurgies for low temperature hybrid bonding, contributing to the development of future microelectronic technologies. You will work in a collaborative and stimulating environment within 3IT and C2MI, two centers of excellence where researchers, students, and industry partners innovate together, offering unique opportunities for professional development and global impact. Topic: . This thesis aims to explore alternatives to copper for metallic bonding in polymer based hybrid bonding processes, in order to enable low temperature bonding for advanced packaging applications such as Fan Out Wafer Level Packaging (FOWLP). The main tasks include:. Conducting at focused literature review on copper oxidation challenges and alternative metals suitable for low t