Characterization and packaging of millimeter-wave devices (M/F)

id="offer-description" class="ecl-u-type-heading-2 ecl-u-mt-none ecl-u-mb-l">Offer Description The PEPR Packaging PACTERA project focuses specifically (packaging chair) on validating the packaging concepts and building blocks developed within the project. The aim is to develop packaging dedicated to individual component supply chains (Renatech) that still need to reach Technology Readiness Levels (TRL) before being used in demonstrators. IEMN has implemented all the high-frequency characterization tools necessary to evaluate the performance of the building blocks and associated subsystems for communications within the targeted frequency range. Within the chair associated with PACTERA, we plan to:. - Characterize the substrates on which the devices will be fabricated (using TDS free-space techniques or VNA techniques on propagation structures (e.g., lines, which will be defined by our colleagues at the CEA)). - Develop packaging in a guiding structure for millimeter-wave signal extraction, and/or on glass for photodiode-based components. This is necessary to consider functionalizing the devices (packaging the devices on glass), ultimately allowing their integration into configurable devices. For this work, the D-band is the target, and the signal transfer techniques will be carried out within the Renapack network. Furthermore, we aim to test the association of photodiodes with active structures using ultrashort "wedge bond" type bonding, which will also be individually evaluat