Postdoctoral Research Associate/Fellow in Semiconductor Packaging & THz Imaging

id="offer-description" class="ecl-u-type-heading-2 ecl-u-mt-none ecl-u-mb-l">Offer Description Postdoctoral Research Associate/Fellow in Advanced Semiconductor Packaging and mmWave/Terahertz Imaging System Integration . Full time, fixed term level A or B for 2-3 years with the possibility of extension . Join the School of Electrical and Computer Engineering and contribute to pioneering research redefining microelectronics and semiconductor technology . Base Salary Academic Level A $117,936-125,896 p.a or Academic Level B $133,533 - $157,381 p.a. + 17% superannuation . About the opportunity . The School of Electrical and Computer Engineering is seeking a highly motivated Postdoctoral Research Associate/Fellow (Level A or Level B) to contribute to a research project focused on the development of advanced microwave technologies for microelectronics and radio frequency system-in-package. Working closely with the Chief Investigator, industry partners and research collaborators, you will contribute to the design, development and integration of next-generation microwave and radio frequency systems. This role offers the opportunity to work at the forefront of semiconductor packaging, heterogeneous integration and high-frequency imaging technologies, while contributing to impactful research outcomes and industry engagement. Your key responsibilities will be to: . design and develop advanced semiconductor packaging and heterogeneous integration solutions for microwave, millimetre-wave