Distinguished Signal & Power Integrity Engineer

NVIDIA · Santa Clara, CA · 320,000 USD – 488,750 USD · remote We are seeking a Distinguished Signal & Power Integrity Engineer to join our dynamic team working with state-of-the-art technology. As a Distinguished Signal & Power Integrity Engineer at NVIDIA, you will lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors. Key Responsibilities: Lead the development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors. Oversee technical direction and implementation for next-gen products ranging from ultra-mobile to high-performance AI and HPC platforms. Architect and deliver state-of-the-art interconnect and packaging solutions for standards such as UCIe, HBM, DDR, PCIe, and industry-leading SerDes (224G/448G). Enable advanced packaging technology solutions for co-packaged optics, stacked die, chiplet-based architectures, and IVR solutions. Develop modeling and characterization flows, flow automations, and design for high-volume manufacturing techniques. Offer strategic counsel as a recognized subject matter expert to senior leadership on emerging technologies, technology investment, and research priorities in signaling, packaging, and system integration. Requirements: 15+ years leading innovations spanning high-speed signal integrity, computational electromagnetics, and semiconductor assembly technologies. MS/PhD in Electrical Engineering or equivalent with 15+ years of industry experience. Hands-on invention and deployment of advanced solutions, e.g., EMIB, UCIe, CPO, high-density connectors. Deep experience with electrical, computer, and packaging engineering and deployment of such in products. Demonstrated ability to manage and mentor teams of highly skilled engineers, define methodologies, and deliver complex projects from research to high-volume manufacturing. Nice to Have: An industry veteran with a proven track record of bringing advanced SI concepts from research to product. A known pioneer in any industry-standard high-speed signaling technology. Deep knowledge of operation and manufacturing challenges of package substrate, PCB, cables, and connectors. Your base salary will be determined based on your location, experience, and other objective job-related factors. The expected base salary range for this position is 320,000 USD – 488,750 USD. You will also be eligible for equity and benefits.