Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate)

The Boeing Company · El Segundo, CA · $98,600 - $133,400 · onsite The Boeing Company, specifically the Boeing Defense, Space and Security (BDS), Space, Intelligence & Weapons Systems (SI&WS) division, is seeking an Associate Space Electronics Packaging and Mechanical Product Design and Analysis Engineer to join their Electronics Packaging and Mechanical Product Design Team in El Segundo, California. As a Space Electronics Packaging Design and Analysis Engineer, you will play a pivotal role in shaping the future of space exploration. You will contribute to every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis. Responsibilities: Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements Perform detailed structural and thermal analysis using hand calculations and analysis tools Document structural analyses and data to show compliance with Boeing, customer, and regulatory requirements Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs) Validate designs through various methods of review, testing, and analysis Develop, deploy, and support new processes and process improvements to enable efficient performance of engineering tasks Conduct Root Cause and Corrective Action to investigate failures and go-forward plans Identify, track, and status technical performance measures to measure progress and ensure compliance with requirements Support Supplier Management with make/buy recommendations and other technical services of limited scope Investigate emerging technologies to develop concepts for future product designs The position requires 2+ years of experience using Computer-Aided Design (CAD) tools and experience in electronic packaging, printed circuit board design and assembly (PCB/PCBA), or thermal, structural, dynamics, and/or vibration analysis and tools. Benefits include competitive base pay and variable compensation opportunities, health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and various programs for paid and unpaid time away from work. The pay range for this position is $98,600 - $133,400.